首頁晶振行業(yè)動(dòng)態(tài) Ecliptek用于節(jié)能MCU的音叉晶體EB13K2C2H-32.768K
Ecliptek用于節(jié)能MCU的音叉晶體EB13K2C2H-32.768K
來源:http://m.review-result.com 作者:億金電子 2022年05月05
在過去的兩年中,供應(yīng)鏈的挑戰(zhàn)使得具有較低電鍍負(fù)載的行業(yè)標(biāo)準(zhǔn)3.2x1.5mm和2.0x1.2mm音叉石英晶體的大批量供應(yīng)變得非常復(fù)雜。但是,Abracon的1.6x1.0x0.5mmABS05鍍4.0pF可以輕松替代當(dāng)前節(jié)能MCU和其他大猩猩芯片組設(shè)計(jì)中的更大尺寸替代品,而不會(huì)犧牲性能要求或增加額外的設(shè)計(jì)壓力。它還可以在較新的設(shè)計(jì)中進(jìn)一步減少消耗的表面積。此外,設(shè)計(jì)人員可能希望在他們的設(shè)計(jì)中考慮全面、包羅萬象的焊盤圖案。
在過去的兩年中,供應(yīng)鏈的挑戰(zhàn)使得具有較低電鍍負(fù)載的行業(yè)標(biāo)準(zhǔn)3.2x1.5mm和2.0x1.2mm音叉石英晶體的大批量供應(yīng)變得非常復(fù)雜。Abracon晶振考慮到這一挑戰(zhàn),開發(fā)了其微型ABS05系列的4.0pF鍍層版本。
ECLIPTEK Crystal是頻率控制市場公認(rèn)的市場領(lǐng)導(dǎo)者。Ecliptek品牌專注于快速轉(zhuǎn)向可編程晶體和MEMS振蕩器設(shè)備,可縮短上市時(shí)間并消除較長的交貨時(shí)間。Ecliptek由Abracon提供支持,Abracon提供最新的技術(shù)設(shè)計(jì)支持和全球供應(yīng)鏈靈活性,以解決客戶當(dāng)今面臨的獨(dú)特挑戰(zhàn)。
EB13K2C2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±100ppm | 0°Cto+70°C |
EB13K2D2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±50ppm | 0°Cto+70°C |
EB13K2E2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±25ppm | 0°Cto+70°C |
EB13K2F2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±20ppm | 0°Cto+70°C |
EB13K2G2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±100ppm | -40°Cto+85°C |
EB13K2H2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±50ppm | -40°Cto+85°C |
EB13K2J2H-32.768K | CMOS | 3.3Vdc | SMD2.0mmx2.5mm | ±25ppm | -40°Cto+85°C |
EB13K4C2H-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±100ppm | 0°Cto+70°C |
EB13K4D2H-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±50ppm | 0°Cto+70°C |
EB13K4E2H-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±25ppm | 0°Cto+70°C |
EB13K4G2H-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±100ppm | -40°Cto+85°C |
EB13K4H2H-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±50ppm | -40°Cto+85°C |
EB13K4J2H-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±25ppm | -40°Cto+85°C |
EB13K5C2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±100ppm | 0°Cto+70°C |
EB13K5D2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±50ppm | 0°Cto+70°C |
EB13K5E2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±25ppm | 0°Cto+70°C |
EB13K5F2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±20ppm | 0°Cto+70°C |
EB13K5G2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±100ppm | -40°Cto+85°C |
EB13K5H2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±50ppm | -40°Cto+85°C |
EB13K5J2H-32.768K | CMOS | 3.3Vdc | SMD3.2mmx5.0mm | ±25ppm | -40°Cto+85°C |
EB13K7C2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±100ppm | 0°Cto+70°C |
EB13K7D2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±50ppm | 0°Cto+70°C |
EB13K7E2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±25ppm | 0°Cto+70°C |
EB13K7F2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±20ppm | 0°Cto+70°C |
EB13K7G2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±100ppm | -40°Cto+85°C |
EB13K7H2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±50ppm | -40°Cto+85°C |
EB13K7J2H-32.768K | CMOS | 3.3Vdc | SMD5.0mmx7.0mm | ±25ppm | -40°Cto+85°C |
EB15K2C2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±100ppm | 0°Cto+70°C |
EB15K2D2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±50ppm | 0°Cto+70°C |
EB15K2E2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±25ppm | 0°Cto+70°C |
EB15K2F2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±20ppm | 0°Cto+70°C |
EB15K2G2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±100ppm | -40°Cto+85°C |
EB15K2H2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±50ppm | -40°Cto+85°C |
EB15K2J2H-32.768K | CMOS | 2.5Vdc | SMD2.0mmx2.5mm | ±25ppm | -40°Cto+85°C |
EB15K4C2H-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±100ppm | 0°Cto+70°C |
EB15K4D2H-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±50ppm | 0°Cto+70°C |
EB15K4E2H-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±25ppm | 0°Cto+70°C |
EB15K4G2H-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±100ppm | -40°Cto+85°C |
EB15K4H2H-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±50ppm | -40°Cto+85°C |
EB15K4J2H-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±25ppm | -40°Cto+85°C |
EB15K5C2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±100ppm | 0°Cto+70°C |
EB15K5D2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±50ppm | 0°Cto+70°C |
EB15K5E2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±25ppm | 0°Cto+70°C |
EB15K5F2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±20ppm | 0°Cto+70°C |
EB15K5G2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±100ppm | -40°Cto+85°C |
EB15K5H2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±50ppm | -40°Cto+85°C |
EB15K5J2H-32.768K | CMOS | 2.5Vdc | SMD3.2mmx5.0mm | ±25ppm | -40°Cto+85°C |
EB15K7C2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±100ppm | 0°Cto+70°C |
EB15K7D2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±50ppm | 0°Cto+70°C |
EB15K7E2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±25ppm | 0°Cto+70°C |
EB15K7F2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±20ppm | 0°Cto+70°C |
EB15K7G2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±100ppm | -40°Cto+85°C |
EB15K7H2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±50ppm | -40°Cto+85°C |
EB15K7J2H-32.768K | CMOS | 2.5Vdc | SMD5.0mmx7.0mm | ±25ppm | -40°Cto+85°C |
EB16K2C2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±100ppm | 0°Cto+70°C |
EB16K2D2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±50ppm | 0°Cto+70°C |
EB16K2E2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±25ppm | 0°Cto+70°C |
EB16K2F2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±20ppm | 0°Cto+70°C |
EB16K2G2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±100ppm | -40°Cto+85°C |
EB16K2H2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±50ppm | -40°Cto+85°C |
Abracon的ABS07系列3.2x15x0.9毫米音叉石英晶體已成為從工業(yè)和醫(yī)療電子產(chǎn)品到消費(fèi)物聯(lián)網(wǎng)小工具的廣泛應(yīng)用中使用的工作室解決方案。隨著下一代MCU的使用已經(jīng)站穩(wěn)腳跟,對ABS07的較低電鍍負(fù)載(低至4.0pF)版本的需求獲得了動(dòng)力。
同時(shí),業(yè)界不斷追求終端產(chǎn)品設(shè)計(jì)小型化的趨勢已經(jīng)讓位于以Abracon的ABS06系列產(chǎn)品為代表的2.0x1.2x0.6毫米音叉石英晶體的需求。特別是Abracon的4.0pF電鍍負(fù)載的ABS06-107引起了廣泛關(guān)注。它提供了較低電鍍負(fù)載與優(yōu)化等效串聯(lián)電阻(ESR)性能的獨(dú)特組合,使其非常適合節(jié)能大猩猩芯片。
EB16K2J2H-32.768K | CMOS | 1.8Vdc | SMD2.0mmx2.5mm | ±25ppm | -40°Cto+85°C |
EB16K4C2H-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±100ppm | 0°Cto+70°C |
EB16K4D2H-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±50ppm | 0°Cto+70°C |
EB16K4E2H-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±25ppm | 0°Cto+70°C |
EB16K4G2H-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±100ppm | -40°Cto+85°C |
EB16K4H2H-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±50ppm | -40°Cto+85°C |
EB16K4J2H-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±25ppm | -40°Cto+85°C |
EMRB61B-32.768K | CMOS | 1.8Vdc | SMD1.2mmx2.0mm | ±75ppm | -10°Cto+70°C |
EMRB61C-32.768K | CMOS | 1.8Vdc | SMD1.2mmx2.0mm | ±100ppm | -40°Cto+85°C |
EMRB62B-32.768K | CMOS | 2.5Vdc | SMD1.2mmx2.0mm | ±75ppm | -10°Cto+70°C |
EMRB62C-32.768K | CMOS | 2.5Vdc | SMD1.2mmx2.0mm | ±100ppm | -40°Cto+85°C |
EMRB63B-32.768K | CMOS | 3.3Vdc | SMD1.2mmx2.0mm | ±75ppm | -10°Cto+70°C |
EMRB63C-32.768K | CMOS | 3.3Vdc | SMD1.2mmx2.0mm | ±100ppm | -40°Cto+85°C |
EMRB64B-32.768K | CMOS | 2.8Vdc | SMD1.2mmx2.0mm | ±75ppm | -10°Cto+70°C |
EMRB64C-32.768K | CMOS | 2.8Vdc | SMD1.2mmx2.0mm | ±100ppm | -40°Cto+85°C |
EMRB65B-32.768K | CMOS | 3.0Vdc | SMD1.2mmx2.0mm | ±75ppm | -10°Cto+70°C |
EMRB65C-32.768K | CMOS | 3.0Vdc | SMD1.2mmx2.0mm | ±100ppm | -40°Cto+85°C |
EMRB81B-32.768K | CMOS | 1.8Vdc | CSP0.8mmx1.5mm | ±75ppm | -10°Cto+70°C |
EMRB81C-32.768K | CMOS | 1.8Vdc | CSP0.8mmx1.5mm | ±100ppm | -40°Cto+85°C |
EMRB82B-32.768K | CMOS | 2.5Vdc | CSP0.8mmx1.5mm | ±75ppm | -10°Cto+70°C |
EMRB82C-32.768K | CMOS | 2.5Vdc | CSP0.8mmx1.5mm | ±100ppm | -40°Cto+85°C |
EMRB83B-32.768K | CMOS | 3.3Vdc | CSP0.8mmx1.5mm | ±75ppm | -10°Cto+70°C |
EMRB83C-32.768K | CMOS | 3.3Vdc | CSP0.8mmx1.5mm | ±100ppm | -40°Cto+85°C |
EMRB84B-32.768K | CMOS | 2.8Vdc | CSP0.8mmx1.5mm | ±75ppm | -10°Cto+70°C |
EMRB84C-32.768K | CMOS | 2.8Vdc | CSP0.8mmx1.5mm | ±100ppm | -40°Cto+85°C |
EMRB85B-32.768K | CMOS | 3.0Vdc | CSP0.8mmx1.5mm | ±75ppm | -10°Cto+70°C |
EMRB85C-32.768K | CMOS | 3.0Vdc | CSP0.8mmx1.5mm | ±100ppm | -40°Cto+85°C |
然而,1.6x1.0x0.5mm的ABS05系列可以輕松替換當(dāng)前設(shè)計(jì)中較大尺寸的ABS06和ABS07系列,而不會(huì)犧牲性能要求或增加額外的設(shè)計(jì)壓力。它還可以在較新的設(shè)計(jì)中進(jìn)一步減少消耗的表面積。
EMTB81A3D-32.768K | CMOS | 1.8Vdc | CSP0.8mmx1.5mm | ±5.0ppm | 0°Cto+70°C |
EMTB81A8D-32.768K | CMOS | 1.8Vdc | CSP0.8mmx1.5mm | ±5.0ppm | -40°Cto+85°C |
EMTB82A3D-32.768K | CMOS | 2.5Vdc | CSP0.8mmx1.5mm | ±5.0ppm | 0°Cto+70°C |
EMTB82A8D-32.768K | CMOS | 2.5Vdc | CSP0.8mmx1.5mm | ±5.0ppm | -40°Cto+85°C |
EMTB83A3D-32.768K | CMOS | 3.3Vdc | CSP0.8mmx1.5mm | ±5.0ppm | 0°Cto+70°C |
EMTB83A8D-32.768K | CMOS | 3.3Vdc | CSP0.8mmx1.5mm | ±5.0ppm | -40°Cto+85°C |
EMTB84A3D-32.768K | CMOS | 2.8Vdc | CSP0.8mmx1.5mm | ±5.0ppm | 0°Cto+70°C |
EMTB84A8D-32.768K | CMOS | 2.8Vdc | CSP0.8mmx1.5mm | ±5.0ppm | -40°Cto+85°C |
EMTB85A3D-32.768K | CMOS | 3.0Vdc | CSP0.8mmx1.5mm | ±5.0ppm | 0°Cto+70°C |
EMTB85A8D-32.768K | CMOS | 3.0Vdc | CSP0.8mmx1.5mm | ±5.0ppm | -40°Cto+85°C |
EQTB31D1DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+50°C |
EQTB31D2DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -10°Cto+60°C |
EQTB31D3DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+70°C |
EQTB31D4DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -20°Cto+70°C |
EQTB31D5DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+60°C |
EQTB31D6DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+75°C |
EQTB31D7DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+85°C |
EQTB31D8DH-32.768K | CMOS | 1.8Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -40°Cto+85°C |
EQTB32D1DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+50°C |
EQTB32D2DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -10°Cto+60°C |
采用最先進(jìn)的調(diào)諧技術(shù),ABS05器件現(xiàn)在可提供±20ppm和±25ppm的設(shè)置容差,有效的振蕩器環(huán)路負(fù)載電容為4.0pF。此外,ESR經(jīng)過優(yōu)化以保持最大90kΩ的閾值,在與最新的節(jié)能MCU和其他大猩猩芯片組配合時(shí)實(shí)現(xiàn)穩(wěn)健運(yùn)行。
此外,由于最近的供應(yīng)鏈問題,設(shè)計(jì)人員可能希望在他們的設(shè)計(jì)中考慮全面、包羅萬象的焊盤圖案。這種方法通過在同一布局中使用ABS07、ABS06或ABS05封裝來滿足設(shè)計(jì)要求,從而提供了設(shè)計(jì)靈活性。
EQTB32D3DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+70°C |
EQTB32D4DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -20°Cto+70°C |
EQTB32D5DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+60°C |
EQTB32D6DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+75°C |
EQTB32D7DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+85°C |
EQTB32D8DH-32.768K | CMOS | 2.5Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -40°Cto+85°C |
EQTB33D1DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+50°C |
EQTB33D2DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -10°Cto+60°C |
EQTB33D3DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+70°C |
EQTB33D4DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -20°Cto+70°C |
EQTB33D5DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+60°C |
EQTB33D6DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+75°C |
EQTB33D7DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+85°C |
EQTB33D8DH-32.768K | CMOS | 3.3Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -40°Cto+85°C |
EQTB35D1DH-32.768K | CMOS | 3.0Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+50°C |
EQTB35D2DH-32.768K | CMOS | 3.0Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -10°Cto+60°C |
EQTB35D3DH-32.768K | CMOS | 3.0Vdc | SMD2.5mmx3.2mm | ±5.0ppm | 0°Cto+70°C |
EQTB35D4DH-32.768K | CMOS | 3.0Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -20°Cto+70°C |
EQTB35D5DH-32.768K | CMOS | 3.0Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+60°C |
EQTB35D6DH-32.768K | CMOS | 3.0Vdc | SMD2.5mmx3.2mm | ±5.0ppm | -30°Cto+75°C |
Abracon,LLC成立于1992年,是無源元件的行業(yè)領(lǐng)導(dǎo)者,通過全球分銷網(wǎng)絡(luò)提供頻率控制和定時(shí)設(shè)備、射頻和天線以及電感器和連接解決方??案。Abracon總部位于德克薩斯州斯派斯伍德,在全球擁有銷售、工程和運(yùn)營團(tuán)隊(duì)。Abracon晶振以服務(wù)、質(zhì)量和技術(shù)專長為公司核心,為AELCrystals、Ecliptek、Fox、ILSI和ProAnt品牌提供支持,同時(shí)在通信、運(yùn)輸、工業(yè)、醫(yī)療、消費(fèi)、航空航天等市場實(shí)現(xiàn)創(chuàng)新的互聯(lián)物聯(lián)網(wǎng)解決方案和防御,以及超越。訪問m.review-result.com了解更多信息。
EQTB35D7DH-32.768K | CMOS | 3.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -30°C to +85°C |
EQTB35D8DH-32.768K | CMOS | 3.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -40°C to +85°C |
EQTB3AD1DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | 0°C to +50°C |
EQTB3AD2DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -10°C to +60°C |
EQTB3AD3DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | 0°C to +70°C |
EQTB3AD4DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -20°C to +70°C |
EQTB3AD5DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -30°C to +60°C |
EQTB3AD6DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -30°C to +75°C |
EQTB3AD7DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -30°C to +85°C |
EQTB3AD8DH-32.768K | CMOS | 5.0Vdc | SMD 2.5mm x 3.2mm | ±5.0ppm | -40°C to +85°C |
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